PRESSURE SWING ADSORPTION (PSA) NITROGEN GAS GENERATOR / PLANT:
What is PSA Process?
“PSA” stands for Pressure Swing Adsorption.  This is the separation technology which separates Nitrogen and Oxygen Molecules from rich compressed air.  Commercial nitrogen production process usually employ Carbon Molecular Sieves as adsorbents.  These process depends on kinetic separation accomplished by a faster diffusion of oxygen molecules through the pore structure of the adsorbent.  The Oxygen is adsorbed to its equilibrium value much faster than Nitrogen.  This is because Oxygen which is smaller in size (kinetic diameter 3.46 A.o) diffuses much faster in Carbon Molecular Sieves than Nitrogen (kinetic diameter 3.64 A.o).
How Does it Works ?
This  equipment  comprises  2  beds  filled  with  Carbon  Molecular  Sieves  and  08-Nos.  control  valves interconnecting  both  the  beds.  The  compressed  air at 7.0 Kg/Cm2G  is  passed  through  the  bottom of  the  bed-1  and  Nitrogen  is  recovered  at  the  top  at  5.5 Kg/Cm2G  pressure while the other bed is simultaneously regenerated by depressurization to atmospheric pressure.
MODELS OF PSA NITROGEN GAS GENERATOR  GAS COMPOSITION MODEL ATLP MODEL ATHP MODEL ATUHP MODEL ATSUHP  NITROGEN  UPTO 98.0 % UPTO 99.9 %  UPTO 9.9999 % UPTO 99.9999 %  OXYGEN   UPTO 2.0 %   UPTO 0.1 %   UPTO 1-3 PPM UPTO 1 PPM  HYDROGEN  NIL   NIL  = 0.5 % NIL  ATM.DEW POINT (DEG.C.)  (-) 40 Deg. C. to (-) 80 Deg. C. (-) 40 Deg. C. to (-) 80 Deg. C. (-) 60  Deg.  C.  to  (-) 80 Deg. C. (-) 40 Deg. C. to (-) 80 Deg. C.

MODEL ATLP AND ATHP :

These are the basic and simplest model of Nitrogen Gas Generator, Which produces commercial grade Nitrogen upto 99.9 % purity.  Still if further high nitrogen gas purity  is needed then one has to add more quantity of Carbon Molecular Sieves (CMS) where purity of 99.999 %  can also be achieved.  Always higher the purity. Higher would be the investment and higher would be its running cost.  These models are strictly recommended upto the purity of 99.9 % .

APPLICATION :

Ø      Blanketing in Process Plant, Chemical & Petro-Chemical Industries. Ø      Storage against Oxygen and Moisture. Ø      Pressure transfer of sensitive Chemicals. Ø      Packing against Oxidation Contamination in Food, Dairy, Pharmaceutical. Ø      Fire Control in Coal Mines. Ø      POY / PFY process.

FLOW SCHEME DIAGRAM :

MODEL ATUHP :

In addition to the basic simplest model  yielding 99.0 % Nitrogen, Hydrogen (from Ammonia  Cracker or from Hydrogen Bottle) is mixed and is passed through a Palladium based Deoxo unit where the below specified reaction takes place :

O2 + 2H2     2H2O  +  Heat

After above reaction the product Gas would be with higher temperature which is cooled down in a Heat Exchanger and simultaneously its moisture is removed by the Gas Dryer.The Gas Composition of this model comprises 1 to 3 PPM of Oxygen content and 0.5 to 5.0 %  Hydrogen which is desirable as reducing agent in most of the Heat Treatment Application.  Atmosphere of desired composition and character is made by selective addition of Hydrogen / Hydro-Carbon, Methanol to Nitrogen as appropriate to specific heat treatment process and metals to be treated.

APPLICATION:

Ø      Heat Treatment Application to avoid Oxidation in Metallurgical Industries.  Ø     Nitrogen Based Control Furnace whose atmospheres in heat treatment process like Annealing, Normalizing, Carburizing, Hardening etc. of metals.  Ø      All type of Chemical, Food, Dairy, Petro-Chemical, Pigments, Paints, Packing Industries etc.

FLOW SCHEME DIAGRAM :

MODEL ATSUHP :

This model  is suitable for Oxygen free Nitrogen.  The product Gas comprises 1 PPM Oxygen and Zero Hydrogen (or adjustable as desired).  This Composition is achieved by adding a module called Copper-Deoxo consisting of Cupric Oxide. The following would be the chemical reaction :

02 + 2Cu --------------> 2CuO

After above reaction the product Gas would be with higher temperature which is cooled down in a Heat Exchanger and simultaneously its moisture is removed by the Gas Dryer.

APPLICATION:

Ø      Semi-Conductor application Ø      Electronics etc.

FLOW SCHEME DIAGRAM :

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